About us / History

03월 ITX30 출시 (Intel LGA1155, 1156 CPU용)
12월 Smart Clip 4.0 개발 (LGA2011용 양단볼트 포함)
03월 Smart Clip 3.5 개발 및 배포 (775,1155,1156,1366,AM2,AM2+,AM3,AM3+ 지원)
02월  TRINITY 출시
08월 BADA2010 PC방 6팩(LGA1156) 출시
03월 baram2010 출시
02월  bada2010 출시
11월 BARAM Shine 출시 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원)
10월 BADA 출시 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원)
09월 Smart Clip 3rd 개발 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원)
04월 Smart Clip 2nd 개발
01월 Smart Clip 개발 (Intel 775, 1366 지원)
01월 Nano Silencer 2009 출시 (Intel 775 / AMD AM2, AM2+, AM3 지원)
11월 BARAM 출시
August Released AM2, AM2+ Clip Set for Nano Silencer
March Released slim cooler for Micro Silencer- socket775 (Height 59mm, Weight 276g)
March Released slim cooler for Nano Silencer- socket775 (Height 39mm , Weight 214g)
June Patent application: Heat pipe test equipment
June Patent application: Heat exchanger
June Patent application: Heat pipe heat sink and its manufacturing method
May Create manufacturing infrastructure for heat pipe heat sink and extruded heat sink
May Thermal product: Released high performance thermal grease TL5-H(8W/mK)
April Thermal test equipment: Released automatic test equipment for heat sink thermal resistance TLS-M
January Thermal Design : UMPC Thermal Solution
November Thermal design: low noise cooling module for special equipment
August Thermal design: low noise thermal solution and cooling module for home server
July Patent application: Developed safe operation method of temperature sensor for spring cooler
June Thermal design: Improvement of air current and cooling module for VOIP server
February Thermal design: Developed heat collection plate of heat pipes for automatic spreading fire extinguisher
January Patent application: Automatic temperature controller and its method
December Patent application: Cooling device inbedded print circuit board and its manufacturing method
December Patent application: Heat pipe structure equipped with Louver Fin
December Selected as Gyunggi internet trade frontier enterprise
September Developed and delivered cooler heat resistance test equipment for PC
June Thermal design: Cooling module of compressed air for oxygen generator
June Registered factory
May Thermal design: Developed cooling module of power LED for projection TV
April Selected as an Industry Family (By Gyunggi Small & Medium Business Supporting Center)
April 산업패밀리 지정 (경기중소기업종합지원센터)
March Changed over to a corporation body as ThermoLab Co., Ltd.
September Developed high efficient Louver Fin heat pipe cooler
September Thermal design: Fanless solution for IP TV
April Developed water cooling set for PC
March Developed air cooling cooler equipped with micro heat pipe of 1.8 phi.
March Changed over to a corporation body as ThermoLab Co., Ltd.
October Registered patent: Reciprocate pump without take-in & exhaust valve and heat exchanger equipped with it
October Registered patent: Slim type heat exchanger
September Completed development of DC pump using power device for PC.
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