| 2012 |
|
| 2011 |
|
| 2010 |
|
| 2009 |
| 11월 |
BARAM Shine 출시 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원) |
| 10월 |
BADA 출시 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원) |
| 09월 |
Smart Clip 3rd 개발 (Intel 775, 1156, 1366 / AMD AM2, AM2+, AM3 지원) |
| 04월 |
Smart Clip 2nd 개발 |
| 01월 |
Smart Clip 개발 (Intel 775, 1366 지원) |
| 01월 |
Nano Silencer 2009 출시 (Intel 775 / AMD AM2, AM2+, AM3 지원) | |
| 2008 |
|
| 2007 |
| June |
Patent application: Heat pipe test equipment |
| June |
Patent application: Heat exchanger |
| June |
Patent application: Heat pipe heat sink and its manufacturing method |
| May |
Create manufacturing infrastructure for heat pipe heat sink and extruded heat sink |
| May |
Thermal product: Released high performance thermal grease TL5-H(8W/mK) |
| April |
Thermal test equipment: Released automatic test equipment for heat sink thermal resistance TLS-M |
| January |
Thermal Design : UMPC Thermal Solution | |
| 2006 |
| November |
Thermal design: low noise cooling module for special equipment |
| August |
Thermal design: low noise thermal solution and cooling module for home server |
| July |
Patent application: Developed safe operation method of temperature sensor for spring cooler |
| June |
Thermal design: Improvement of air current and cooling module for VOIP server |
| February |
Thermal design: Developed heat collection plate of heat pipes for automatic spreading fire extinguisher |
| January |
Patent application: Automatic temperature controller and its method | |
| 2005 |
| December |
Patent application: Cooling device inbedded print circuit board and its manufacturing method |
| December |
Patent application: Heat pipe structure equipped with Louver Fin |
| December |
Selected as Gyunggi internet trade frontier enterprise |
| September |
Developed and delivered cooler heat resistance test equipment for PC |
| June |
Thermal design: Cooling module of compressed air for oxygen generator |
| June |
Registered factory |
| May |
Thermal design: Developed cooling module of power LED for projection TV |
| April |
Selected as an Industry Family (By Gyunggi Small & Medium Business Supporting Center) |
| April |
산업패밀리 지정 (경기중소기업종합지원센터) |
| March |
Changed over to a corporation body as ThermoLab Co., Ltd. | |
| 2004 |
| September |
Developed high efficient Louver Fin heat pipe cooler |
| September |
Thermal design: Fanless solution for IP TV |
| April |
Developed water cooling set for PC |
| March |
Developed air cooling cooler equipped with micro heat pipe of 1.8 phi. |
| March |
Changed over to a corporation body as ThermoLab Co., Ltd. | |
| 2003 |
| October |
Registered patent: Reciprocate pump without take-in & exhaust valve and heat exchanger equipped with it |
| October |
Registered patent: Slim type heat exchanger |
| September |
Completed development of DC pump using power device for PC. | |
